Use the micro Process of patterned profiles and the self-assembled monolayer copied

Use the micro Process of patterned profiles and the self-assembled monolayer copied

  • CN 101,243,209 B
  • Filed: 07/31/2006
  • Issued: 03/23/2016
  • Est. Priority Date: 08/10/2005
  • Status: Active Grant
First Claim
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1. the method for the metal deposit of working diagram patterning in substrate, described method comprises:

  • There is provided a kind of instrument with the nanostructured surface of patterning, described surface has the nanostructured surface region comprising the microscale topographical formed by electro-plating method;

    The nanostructured surface of the patterning of described instrument is copied in substrate to form the substrate patterned nanostructured surface with substrate nanostructured surf zone;

    Metal level is arranged on described substrate patterned nanostructured surface to form the nanostructured surface with the metal pattern of metallic nanostructured surf zone;

    The nanostructured surface of described metal pattern comprising described metallic nanostructured surf zone forms self-assembled monolayer;

    Described self-assembled monolayer is exposed to the chemical plating solution comprising metal refining;

    WithBy described metal refining optionally electroless plating on described metallic nanostructured surf zone.

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