Encapsulation structure of optoelectronic component

Encapsulation structure of optoelectronic component

  • CN 101,291,042 A
  • Filed: 04/16/2007
  • Published: 10/22/2008
  • Est. Priority Date: 04/16/2007
  • Status: Active Application
First Claim
Patent Images

1. , a kind of photoelectric element-packaging structure is used to encapsulate a luminescence unit and links with an outer member, it is characterized in that this encapsulating structure includes:

  • One substrate, this luminescence unit are electrically connected on this substrate;

    One first clamshell is fixedly arranged on this substrate, and this clamshell has an inner space and one first joint, and this luminescence unit is arranged on the substrate in this inner space of this first clamshell;

    One second clamshell has one second joint and a collar, this second joint and this first connector engages, and this collar is in order to accept this outer member;

    AndOne eyeglass is arranged at this collar bottom of this second clamshell, in order to transmit the light that this luminescence unit is launched.

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