Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board

Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board

  • CN 101,297,242 A
  • Filed: 10/20/2006
  • Published: 10/29/2008
  • Est. Priority Date: 10/25/2005
  • Status: Active Application
First Claim
Patent Images

1. photosensitive polymer combination, it is for containing the optical polymerism compound that has the ethene unsaturated group that at least one can polymerization in (A) binder polymer, (B) molecule and (C) photosensitive polymer combination of Photoepolymerizationinitiater initiater, wherein, as (B) composition, the compound that contains following general formula (I) expression

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×