Multi-chip electronic system

Multi-chip electronic system

  • CN 101,304,022 B
  • Filed: 05/08/2008
  • Issued: 08/26/2015
  • Est. Priority Date: 05/08/2007
  • Status: Active Grant
First Claim
Patent Images

1. be suitable for performing corresponding function and the electronic system comprising at least the first subsystem and the second subsystem, wherein this first subsystem and the second subsystem by the exercisable mutual coupling of multiple electrical connection to perform the function of this system, can is characterized in that,This first subsystem and the second subsystem are integrated on the first material chip and the second material chip respectively, and described multiple electrical connection comprise multiple realization described first and second chips at least one in conductive through hole and be suitable for realizing when this first and second chip superposes the electrical connection of corresponding multiple chip chamberWherein this first subsystem and the second subsystem are implemented by corresponding first and second manufacturing process, and this first and second manufacturing process is exclusively used in corresponding subsystem, and this second manufacturing process is not suitable for realizing this first subsystem,Wherein this first subsystem and the second subsystem comprise Service Circuit structure and functional circuit core respectively.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×