Method for manufacturing a microelectromechanical component, and a microelectromechanical component

Method for manufacturing a microelectromechanical component, and a microelectromechanical component

  • CN 101,312,903 A
  • Filed: 11/21/2006
  • Published: 11/26/2008
  • Est. Priority Date: 11/23/2005
  • Status: Active Application
First Claim
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1. method of making microcomputer electric component, in described method, mems chip parts (46) are by coating member (24), (28), (33), (41), (47), (48) sealing, described coating member (24), (28), (33), (41), (47), (48) comprise and be used to pass described coating member (24), (28), (33), (41), (47), (48) provide the introducing structure of electrical connection, it is characterized in that, in described method, first parts are one of following parts, second parts be different from described first parts another and also be one of following parts:

  • -by the described mems chip parts (46) of described coating member (24), (28), (33), (41), (47), (48) sealing, perhaps-electronic circuit component (64), (74),Thereby,-by means of first combination member (61-63), (75-79), described first parts are bonded to described second parts,-described second parts are made second combination member (66-67), (69-70), (81-82), (84-85), (86-87) of the outside connection that is used for described microcomputer electric component greater than described first parts and near described first parts on the surface of described second parts.

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