Interconnection process

Interconnection process

  • CN 101,315,902 A
  • Filed: 05/26/2008
  • Published: 12/03/2008
  • Est. Priority Date: 06/01/2007
  • Status: Active Application
First Claim
Patent Images

1. interconnection process comprises:

  • (a) provide semiconductor substrate with conductive region;

    (b) form dielectric layer covering this semiconductor substrate with contact hole, and this conductive region of this contact hole expose portion;

    (c) this semiconductor substrate that is coated with this dielectric layer is heat-treated;

    And(d) form conductive layer on this dielectric layer.

View all claims

    Thank you for your feedback