Wiring board and its fabricating method

Wiring board and its fabricating method

  • CN 101,315,917 A
  • Filed: 05/30/2008
  • Published: 12/03/2008
  • Est. Priority Date: 05/30/2007
  • Status: Active Application
First Claim
Patent Images

1. wiring substrate comprises:

  • Insulating barrier;

    Wiring layer, it is arranged on a side of described insulating barrier;

    External connection pads, it is arranged on the opposite side of described insulating barrier;

    Overlay coating, it is formed on the described external connection pads, is used to be connected to external circuit, wherein,The area of described external connection pads is less than the area of described overlay coating.

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