Lead-free solder alloys and solder joints thereof with improved drop impact resistance

Lead-free solder alloys and solder joints thereof with improved drop impact resistance

  • CN 101,326,295 A
  • Filed: 12/13/2006
  • Published: 12/17/2008
  • Est. Priority Date: 12/13/2005
  • Status: Active Application
First Claim
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1. leadless welding alloy, it comprises:

  • the Ag of 0.0-4.0wt.%, the Cu of 0.01-1.5wt.%, additive below at least a;

    the Ti of the amount of Y, the 0.001-0.8wt.% of the amount of Ce, the 0.001-1.0wt.% of the Mn of the amount of 0.001-1.0wt.%, the amount of 0.001-0.8wt.% and the Bi of the amount of 0.01-1.0wt.% and the Sn of surplus.

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