Wafer based camera module and method of manufacture

Wafer based camera module and method of manufacture

  • CN 101,326,811 A
  • Filed: 10/10/2006
  • Published: 12/17/2008
  • Est. Priority Date: 10/11/2005
  • Status: Active Application
First Claim
Patent Images

1. photographing module comprises:

  • The shooting integrated circuit (IC) chip;

    Lens;

    AndBe installed in the lens keeper on the described shooting integrated circuit (IC) chip, described lens are by the described relatively shooting integrated circuit (IC) chip of described lens keeper location.

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