Semiconductor device

Semiconductor device

  • CN 101,339,927 A
  • Filed: 07/02/2008
  • Published: 01/07/2009
  • Est. Priority Date: 07/02/2007
  • Status: Active Application
First Claim
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1. device comprises:

  • First semiconductor chip;

    Be embedded with the molding bed of material of described first semiconductor chip;

    Be applied to the layer that electrically conducts of first on the described molding bed of material;

    Be arranged in the through hole in the described molding bed of material;

    Fill the soldering tin material of described through hole.

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