Ultra-thin wafer-level contact grid array

Ultra-thin wafer-level contact grid array

  • CN 101,339,929 A
  • Filed: 11/29/2007
  • Published: 01/07/2009
  • Est. Priority Date: 07/02/2007
  • Status: Active Application
First Claim
Patent Images

1. semiconductor element comprises:

  • Semiconductor grain;

    A plurality of protrusions provide electric connection at printed circuit board (PCB) and this semiconductor die intergranular, and wherein each protrusion of these a plurality of protrusions is not higher than more than the surface 10 μ

    m of this semiconductor grain;

    AndA plurality of welding rods are arranged on the corner of this crystal grain, and wherein each welding rod of these a plurality of welding rods is not higher than more than the surface 10 μ

    m of this semiconductor grain.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×