Method of manufacturing flash memory cards

Method of manufacturing flash memory cards

  • CN 101,341,586 B
  • Filed: 11/01/2006
  • Issued: 01/02/2013
  • Est. Priority Date: 11/02/2005
  • Status: Active Grant
First Claim
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1. a making has the method for the semiconductor packages of general rectangular shape outer peripheral, and described semiconductor packages has at least one external margin that is different from described general rectangular shape, and described semiconductor packages is to form from panel by following steps:

  • (a) described panel is encapsulated in mold compound, makes simultaneously at least one zone not have mold compound;

    (b) from described at least one zone of described panel punching, thereby define described at least one external margin in described semiconductor packages, wherein said at least one zone forms at least one in recess and the inclined-plane;

    And(c) come individualized described semiconductor packages from described panel by the straight edge cuts of passing described panel, at least one straight edge cuts and the described recess of the formation of punching in step (b) and at least one adjacency in the inclined-plane.

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