Printed circuit board manufacturing system and manufacturing method thereof

Printed circuit board manufacturing system and manufacturing method thereof

  • CN 101,355,852 B
  • Filed: 03/03/2008
  • Issued: 07/25/2012
  • Est. Priority Date: 07/25/2007
  • Status: Active Grant
First Claim
Patent Images

1. method of making printed circuit board (PCB) comprises:

  • Substrate is provided, and said substrate comprises pad and the insulating barrier that covers said pad;

    Obtain the image of said substrate;

    Obtain the positional information of said pad through the image of analyzing said substrate;

    Said insulating barrier form via through removing with the corresponding part of said positional information said pad;

    AndForm path through fill said via with electric conducting material.

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