Apparatus for the removal of a set of byproducts from a substrate edge and methods therefor

Apparatus for the removal of a set of byproducts from a substrate edge and methods therefor

  • CN 101,370,965 A
  • Filed: 09/26/2006
  • Published: 02/18/2009
  • Est. Priority Date: 09/27/2005
  • Status: Active Grant
First Claim
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1. a plasma handling system comprises the plasma chamber that is used for treatment substrate, comprising:

  • Chuck, it is configured to support the first surface of described substrate;

    Anti-plasma blocking layer, the mode that it separates with the second surface space that is relevant to described substrate and being arranged, described second surface is relative with described first surface, and described anti-plasma blocking layer is protected the middle portion of described substrate basically and made the annular periphery zone of described second surface of described substrate not protected by described anti-plasma blocking layer;

    AndAt least one powered electrode, described powered electrode cooperates operation being produced plasma by plasma gas with described anti-plasma blocking layer, described plasma is subject to the described annular periphery zone of described substrate on substantially and away from the described middle portion of described substrate.

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