For removing the apparatus and method of accessory substance group from substrate edge

For removing the apparatus and method of accessory substance group from substrate edge

  • CN 101,370,965 B
  • Filed: 09/26/2006
  • Issued: 10/07/2015
  • Est. Priority Date: 09/27/2005
  • Status: Active Grant
First Claim
Patent Images

1. , for removing a plasma handling system for accessory substance group from substrate edge, comprise for the plasma chamber by generating plasma treatment substrate, this plasma handling system comprises:

  • Chuck, it is configured to the first surface supporting described substrate;

    Plasma resistant barrier, be set to when described substrate processes in described plasma chamber and the second surface of described substrate separates, described second surface is relative with described first surface, and described plasma resistant barrier by with lucky above described second surface but the mid portion that the clearance distance not touching this second surface is placed substantially to protect described substrate do not affect by plasma, described plasma resistant barrier stays on the described second surface of described substrate is not substantially protected by described plasma resistant barrier and is exposed to described isoionic annular periphery area, andToroidal inductor group, be located at described plasma chamber inner, when processing described substrate in described plasma chamber, described toroidal inductor group around described substrate at least partially, described toroidal inductor group around described plasma resistant barrier at least partially, and gap is formed between described toroidal inductor group and described plasma resistant barrier, described toroidal inductor assembly is set to and excites described plasma in described gap.

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