Integrated circuit package system with overhanging connection stack

Integrated circuit package system with overhanging connection stack

  • CN 101,383,302 A
  • Filed: 06/27/2008
  • Published: 03/11/2009
  • Est. Priority Date: 06/27/2007
  • Status: Active Application
First Claim
Patent Images

1. , a kind of integrated circuit packaging method (900) comprising:

  • First lead (302) is provided, makes it adjacent with second lead (304);

    Form first in this first lead (302) top and connect and pile up (312), and make this first connect and pile up (312) and overhang second lead (304) top;

    Integrated circuit component (106) first is connected and piles up (312) and link to each other with this;

    AndEncapsulating described integrated circuit component (106) is connected with first and piles up (312).

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