Chip package substrate and projection welding plate construction

Chip package substrate and projection welding plate construction

  • CN 101,388,374 A
  • Filed: 09/10/2007
  • Published: 03/18/2009
  • Est. Priority Date: 09/10/2007
  • Status: Active Application
First Claim
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1. , a kind of projection pad structure, it is disposed in the dielectric layer of chip packaging carrying plate, and this projection pad structure comprises:

  • Conductive pole is disposed in the subsurface blind hole of this dielectric layer, and this conductive pole has an end face, and this end face trims this surface;

    AndPad is positioned on this end face, and connects this conductive pole, and wherein this pad has a bottom surface with respect to this end face, and the area of this bottom surface is equivalent to the area of this end face.

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