Energy-conserving wall structure with controllable semiconductor heat transfer capability

Energy-conserving wall structure with controllable semiconductor heat transfer capability

  • CN 101,392,563 A
  • Filed: 09/18/2008
  • Published: 03/25/2009
  • Est. Priority Date: 09/18/2008
  • Status: Active Grant
First Claim
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1. compound wall construction with controllable semiconductor heat transfer capability, be characterized in that each element of construction all is by having up and down two or two groups of ventilation holes and having the basic body of wall of strong heat-insulating capability, outer body of wall with strong capacity of heat transmission, frame all around with sealability, and by basic body of wall, the bay wall cavity that outer body of wall and frame encirclement all around form is formed jointly, and controlled joint door also is housed at two groups of ventilation hole places up and down, and control corresponding mechanism, can and use needs according to the indoor/outdoor temperature-difference situation, closure or openness by control joint door, realization is to the air inside and outside the ventilation hole, be that whether air in the indoor and bay wall cavity flows and flow direction carries out two-way control, can with the air heat catalysis just, utilize circulating or fluid stopping of ventilation hole inner air and outer air different directions, the directional transmissions of realization heat or heat insulation, make this wall construction on general effect, can have the not semiconductor-type capacity of heat transmission of the same sex of two-way heat transfer, promptly can root different needs and control, have the inside strong capacity of heat transmission and outside strong heat-insulating capability respectively, or the inside strong heat-insulating capability and the outside strong capacity of heat transmission, thereby reaching the purpose of saving heating power consumption or air-conditioning power consumption, is a kind of " energy-conserving wall structure with controllable semiconductor heat transfer capability " therefore.

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