Method of bonding part, method of stacking part, and structure including part bonded

Method of bonding part, method of stacking part, and structure including part bonded

  • CN 101,395,707 A
  • Filed: 02/09/2007
  • Published: 03/25/2009
  • Est. Priority Date: 02/28/2006
  • Status: Active Application
First Claim
Patent Images

1. one kind by adhesive layer being inserted between semiconductor device and the circuit board and the semiconductor device that will have a thermosetting adhesive layer joins the component bonding method of the circuit board that is formed with resin bed on the surface to, and described component bonding method comprises the steps:

  • By described resin bed is carried out the surface that plasma treatment is come the described resin bed of modification;

    Use parts to keep mouth to keep described semiconductor device;

    Make described adhesive layer touch the resin bed of surface modification;

    AndUse the described adhesive layer of heater hot curing.

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