Loading mechanism for bare die packages and lga socket

Loading mechanism for bare die packages and lga socket

  • CN 101,399,241 A
  • Filed: 09/28/2008
  • Published: 04/01/2009
  • Est. Priority Date: 09/28/2007
  • Status: Active Application
First Claim
Patent Images

1. method comprises:

  • The packaging part that comprises the chip that links with substrate is provided, and wherein, described substrate is arranged on land grid array (LGA) socket, and thermal interfacial material (TIM) is set on the upper surface of described chip;

    AndRadiator is connected on the described TIM, and wherein, at least one bearing is connected between described radiator and the described substrate.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×