Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device

Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device

  • CN 101,404,269 A
  • Filed: 09/26/2008
  • Published: 04/08/2009
  • Est. Priority Date: 10/05/2007
  • Status: Active Application
First Claim
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1. a semiconductor device comprises semiconductor substrate and the metal salient point that is provided with on the electrode of this semiconductor substrate, and at least a portion around this metal salient point is formed with solder layer, and this semiconductor device is characterised in that:

  • Above-mentioned metal salient point has protuberance, and this protuberance is outstanding towards the direction of the circuit substrate face that above-mentioned semiconductor device will be installed;

    Between above-mentioned metal salient point and above-mentioned solder layer, be formed with the metal level of the above-mentioned metal salient point of protection.

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