Electronic circuit device and method of making the same

Electronic circuit device and method of making the same

  • CN 101,404,861 A
  • Filed: 09/28/2008
  • Published: 04/08/2009
  • Est. Priority Date: 10/01/2007
  • Status: Active Application
First Claim
Patent Images

1. method of making circuit arrangement comprises:

  • Preparation have at least one projection (33) electronic component (3,3A, 3B);

    With described electronic component (3,3A, 3B) only be installed on first (21) of circuit board (2), make described at least one projection (33) and described circuit board (2) first (21) basically holding point contact, with at described circuit board (2) and described electronic component (3,3A forms the gap between 3B);

    Described circuit board (2) is positioned in the chamber (104) of mould (100), makes second (22) of described circuit board (2) keep closely contacting with the inner surface (102a) of described chamber (104), described second (22) are relative with described first (21);

    AndMake described gap be full of resin material (110) by fill described chamber (104) with resin material (110), with described circuit board (2) and described electronic component (3,3A 3B) is encapsulated in the housing (4),Wherein, second (22) of described circuit board (2) are exposed to the outer surface of described housing (4), with the part of the outer surface that limits described housing (4).

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×