Electronic circuit device and method of making the same

Electronic circuit device and method of making the same

  • CN 101,404,861 B
  • Filed: 09/28/2008
  • Issued: 06/04/2014
  • Est. Priority Date: 10/01/2007
  • Status: Active Grant
First Claim
Patent Images

1. a method of manufacturing circuit arrangement, comprising:

  • Preparation has the electronic component (3,3A, 3B) of at least one projection (33);

    By described electronic component (3,3A, 3B) be only arranged on the first surface (21) of circuit board (2), described at least one projection (33) is contacted with first surface (21) holding point of described circuit board (2), with at described circuit board (2) and described electronic component (3,3A, 3B) between form gap;

    Described circuit board (2) is positioned in the chamber (104) of mould (100), make second (22) of described circuit board (2) and the inner surface (102a) in described chamber (104) keep close contact, described second (22) are relative with described first surface (21);

    AndMake described gap be full of resin material (110) by fill described chamber (104) with resin material (110), by described circuit board (2) and described electronic component (3,3A, 3B) be encapsulated in housing (4)Wherein, second (22) of described circuit board (2) are exposed to the outer surface of described housing (4), to limit the part of outer surface for described housing (4),Wherein, the projection (33) of described electronic component (3,3A, 3B) is taper,Wherein, the first surface (21) of the summit of described projection (33) and described circuit board (2) keeps in touch, andWherein, described at least one projection (33) comprises multiple projections (33) of arranging at regular intervals substantially.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×