Electronic circuit device and method of making the same

Electronic circuit device and method of making the same

  • CN 101,404,863 B
  • Filed: 09/28/2008
  • Issued: 04/15/2015
  • Est. Priority Date: 10/01/2007
  • Status: Active Grant
First Claim
Patent Images

1. manufacture a method for electronic circuit, comprising:

  • Be filled in circuit board (2) by utilizing filling component (71) and be only arranged on the gap between the electronic component (3) on described circuit board (2) first side (21), from described gap, discharging air;

    After discharge air, the lead terminal (31) of described electronic component (3) is welded on the terminal pad (341) of described circuit board (2);

    Described circuit board (2) is placed in the cavity (104) of mould (100), second side (22) of described circuit board (2) is remained and the inner surface of described cavity (104) (102a) close contact, and described second side (22) is relative with described first side (21);

    AndDescribed cavity (104) is filled by utilizing the first liquid resin material, described circuit board (2) and described electronic component (3) are encapsulated in housing (4), described housing (4) has the basic shape for cardWherein, described second side (22) of described circuit board (2) is exposed to the outer surface of described housing (4) to limit a part for the outer surface of described housing (4),Wherein, described filling component (71) is solid-state form, have viscosity and have the plastically deformable parts (71) of the thickness being greater than described gap, andWherein, described shock absorber for output is drawn together and described filling component (71) is adhered to described electronic component (3) and is then pressed in by described electronic component (3) on described circuit board (2) to make described filling component (71) plastic deformation occur to fill described gap.

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