Resin composition and molded product thereof

Resin composition and molded product thereof

  • CN 101,410,459 B
  • Filed: 03/22/2007
  • Issued: 03/27/2013
  • Est. Priority Date: 03/30/2006
  • Status: Active Grant
First Claim
Patent Images

1. conductive component, it is 1 * 10 by surface resistivity 5Ω

  • /sq.~

    1 * 10 14The resin combination of Ω

    /sq. consists of, in the described resin combination, with respect to 100 weight parts, (a) thermoplastic resin, it directly is that 15 μ

    m are following that this resin combination contains 20 weight parts~

    80 weight part average fibers, (b) non-conductive fibrous mineral filler and to add up to the two or more median size of 10 weight parts~

    70 weight parts be 1 μ

    m~

    50 μ

    m'"'"'s, (c) graphite, the median size of described two or more graphite is different, the difference of any two kinds median size is at least more than the 5 μ

    m Described conductive component is to be selected from least a in the group that is comprised of with exterior member, coil sealing element, electric motor sealing element, transistor sealing element paper feeding-discharge tray, gasoline and/or the pure tank circumferential component of the paper-feed roll bearing of xerographic printer, printing equipment, IC protection container, vehicle.

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