Leadframe having a heat sink supporting part, fabricating method of the light emitting diode package using the same and light emitting diode package fabricated by the method
Leadframe having a heat sink supporting part, fabricating method of the light emitting diode package using the same and light emitting diode package fabricated by the method
- CN 101,427,369 A
- Filed: 06/28/2007
- Published: 05/06/2009
- Est. Priority Date: 06/30/2006
- Status: Active Application
- EN CH
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- Pin
