Leadframe having a heat sink supporting part, fabricating method of the light emitting diode package using the same and light emitting diode package fabricated by the method

Leadframe having a heat sink supporting part, fabricating method of the light emitting diode package using the same and light emitting diode package fabricated by the method

  • CN 101,427,369 A
  • Filed: 06/28/2007
  • Published: 05/06/2009
  • Est. Priority Date: 06/30/2006
  • Status: Active Application
First Claim
Patent Images

1. , a kind of lead frame with heat sink supporting part comprises:

  • External frame is around presumptive area;

    Heat sink supporting part extends internally to face with each other from external frame, and each support component has the end that is attached to radiator;

    Lead end extends internally facing with each other from external frame, and separates with support component.

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