Apparatus and method for use in mounting electronic elements

Apparatus and method for use in mounting electronic elements

  • CN 101,432,875 A
  • Filed: 04/25/2007
  • Published: 05/13/2009
  • Est. Priority Date: 04/26/2006
  • Status: Active Grant
First Claim
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1. surface-mount devices comprises:

  • First electrode that comprises the chip carrier part;

    Partly be provided with and by clearance for insulation and separated second electrode of described chip carrier part near described chip carrier;

    AndEncapsulate the shell of the part of the part of described first electrode and described second electrode, and described shell has from the described first surface of described shell and extends to recess the described shell so that at least a portion of described chip carrier part exposes by described recess;

    Described first electrode extends to the periphery of described shell from described chip carrier part, when extending, the periphery of described shell is divided into more than first lead-in wire that is separated by the hole at described first electrode from described chip carrier part, described more than first wire bond becomes to have the single first combined leads part of first width before described first electrode is projected into outside the described shell, and described first electrode keeps described first width outside described shell when described first electrode is projected into outside the described shell;

    AndDescribed second electrode deviates from described chip carrier and partly extends, and reaches second width before outside being projected into described shell, and be projected into described shell outer and described shell outside described second width of maintenance.

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