Routing layer for a microelectronic device, microelectronic package containing same, and method of forming a multi-thickness conductor in same for a microelectronic device

Routing layer for a microelectronic device, microelectronic package containing same, and method of forming a multi-thickness conductor in same for a microelectronic device

  • CN 101,471,322 A
  • Filed: 12/15/2008
  • Published: 07/01/2009
  • Est. Priority Date: 12/15/2007
  • Status: Active Application
First Claim
Patent Images

1. , a kind of wiring layer that is used for microelectronic component, described wiring layer comprises:

  • The first area and the second area that contains second groove of containing first groove;

    AndElectric conducting material in described first groove and described second groove,Wherein;

    Described first groove has first degree of depth;

    Described second groove has second degree of depth;

    AndDescribed first degree of depth is different with described second degree of depth.

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