Apparatus for applying a plating solution for electroless deposition

Apparatus for applying a plating solution for electroless deposition

  • CN 101,479,406 A
  • Filed: 06/27/2007
  • Published: 07/08/2009
  • Est. Priority Date: 06/28/2006
  • Status: Active Application
First Claim
Patent Images

1. electroless-plating chamber, it comprises:

  • Chuck is used for support base;

    Bowl, it surrounds a pedestal and a sidewall of this chuck, and this pedestal has the annular channel that internal diameter defined along this pedestal;

    Liquid discharge pipe, it is connected to this annular channel, and this liquid discharge pipe can remove the fluid of collecting from this chuck;

    AndNearly joint, it can clean and dry basically this substrate.

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