Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device

Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device

  • CN 101,492,565 A
  • Filed: 01/23/2009
  • Published: 07/29/2009
  • Est. Priority Date: 01/25/2008
  • Status: Active Application
First Claim
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1. the manufacture method of an epoxy resin composition for semiconductor encapsulation, described composition contains:

  • (A) have in per 1 molecule 2 above epoxy group(ing) Resins, epoxy,(B) solidifying agent, its for the resol that has 2 above hydroxyls in per 1 molecule,(C) inorganic filling material and(D) carbon black;

    The manufacture method of described composition comprises;

    mixing raw material carbon black, part or all of above-mentioned solidifying agent and organic solvent, filtering out from the mixed solution that obtains can not be by the carbon black coarse grain of 20 μ

    m sieve apertures, then, remove the organic solvent in the filtrate, thereby obtain the pre-composition of (D) composition carbon black and part or all of (B) composition solidifying agent, and carry out mixing this pre-composition and remaining composition.

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