Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device

Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device

  • CN 101,492,565 B
  • Filed: 01/23/2009
  • Issued: 04/29/2015
  • Est. Priority Date: 01/25/2008
  • Status: Active Grant
First Claim
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1. a manufacture method for epoxy resin composition for semiconductor encapsulation, described composition contains:

  • (A) have in every 1 molecule the epoxy resin of more than 2 epoxy group(ing),(B) solidifying agent, its be have in every 1 molecule more than 2 hydroxyls resol,(C) carbon removal infrablack inorganic filling material and(D) carbon black;

    The manufacture method of described composition comprises;

    mixing raw material carbon black, part or all of above-mentioned solidifying agent and organic solvent, filter out not by the carbon black coarse grain of 3 μ

    m of sieve apertures from the mixed solution obtained, then, organic solvent in removing filtrate, thus obtain the pre-composition of (D) composition carbon black and part or all of (B) composition solidifying agent, and carry out mixing to this pre-composition and residual components.

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