Electronic chip contact structure

Electronic chip contact structure

  • CN 101,496,164 B
  • Filed: 06/14/2006
  • Issued: 07/09/2014
  • Est. Priority Date: 06/14/2005
  • Status: Active Grant
First Claim
Patent Images

1. chip contact, is characterized in that, comprises:

  • Integrated circuit (IC) pad;

    Barrier layer above described IC pad;

    AndToughness material above described barrier layer;

    Wherein, in the time of described chip contact and another contact point joint, described toughness material is constituted as and under pressure, is out of shape and is pierced into by the rigid material of described another contact point;

    AndWherein, described toughness material is constituted as with the diffusion impervious layer of described another contact point and spreads mutually.

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