Module including a sintered joint bonding a semiconductor chip to a copper surface

Module including a sintered joint bonding a semiconductor chip to a copper surface

  • CN 101,510,537 A
  • Filed: 02/16/2009
  • Published: 08/19/2009
  • Est. Priority Date: 02/14/2008
  • Status: Active Application
First Claim
Patent Images

1. module comprises:

  • Substrate comprises the first bronze medal surface;

    Semiconductor chip;

    AndFirst sintered joint, with described semiconductor chip Direct Bonding to the described first bronze medal surface.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×