Onium-containing CMP compositions and methods of use thereof

Onium-containing CMP compositions and methods of use thereof

  • CN 101,511,966 A
  • Filed: 09/07/2007
  • Published: 08/19/2009
  • Est. Priority Date: 09/08/2006
  • Status: Active Application
First Claim
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1. a chemical-mechanical polishing (CMP) composition comprises:

  • (a) colloidal silica;

    (at least a compound of) Xuan Zi phosphonium salt, sulfonium salt and combination thereof b;

    (c) aqueous carrier for this reason;

    Said composition has 5 or littler pH value.

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