Semiconductor device and manufacturing method therefor

Semiconductor device and manufacturing method therefor

  • CN 101,521,186 A
  • Filed: 12/08/2008
  • Published: 09/02/2009
  • Est. Priority Date: 02/27/2008
  • Status: Active Application
First Claim
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1. a semiconductor device is characterized in that,Be provided with:

  • the resin shell;

    Be equipped on the semiconductor chip of described resin shell inside;

    Have the relative wire-bonded face and the metal terminal of contact-making surface;

    AndThe lead that connects described wire-bonded face and described semiconductor chip,Described contact-making surface is fixed by welding and face is engaged in described resin shell inside.

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