Multilayer printed wiring board

Multilayer printed wiring board

  • CN 101,521,189 B
  • Filed: 02/03/2005
  • Issued: 10/15/2014
  • Est. Priority Date: 02/04/2004
  • Status: Active Grant
First Claim
Patent Images

1. a multilayer board forms interlayer insulating film and conductor layer on core substrate, by interlayer conduction, uses hole to be electrically connected to, it is characterized in that,Described core substrate is more than 3 layers or the 3 layers multilayer core substrate that has conductor layer at the table back side and have thick conductor layer at internal layer;

  • At least 1 layer in the conductor layer at the conductor layer of the internal layer of described core substrate and the table back side is the conductor layer used of bus plane or earthy conductor layer;

    The side of the conductor layer at the He Biao back side, side of the conductor layer of the internal layer of described core substrate becomes cone-shaped, if linking the straight line of top and bottom and the horizontal plane angulation of core substrate of side of the conductor layer of described internal layer is θ

    1, if linking the straight line of top and bottom and the horizontal plane angulation of core substrate of side of the conductor layer at the described table back side is θ

    2, described θ

    1 and θ

    2 meet 2.8 <

    tan θ

    1 <

    55, the relational expression of 2.8 <

    tan θ

    2 <

    55 and θ

    1 <

    θ

    2.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×