Process for semiconductor device production using under-resist film cured by photocrosslinking

Process for semiconductor device production using under-resist film cured by photocrosslinking

  • CN 101,523,291 A
  • Filed: 10/10/2007
  • Published: 09/02/2009
  • Est. Priority Date: 10/12/2006
  • Status: Active Application
First Claim
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1. the manufacture method of a semiconductor device comprises following operation:

  • be coated with the composition of the formation resist lower membrane that contains polymkeric substance, crosslinking chemical and photoacid generator on semiconductor substrate, thereby form the operation of filming;

    By described filming carried out the operation that illumination forms lower membrane;

    With composition and heat, form the operation of photoresist by painting photoresist on described lower membrane.

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