Pin bonding structure

Pin bonding structure

  • CN 101,526,676 A
  • Filed: 03/06/2008
  • Published: 09/09/2009
  • Est. Priority Date: 03/06/2008
  • Status: Active Application
First Claim
Patent Images

1. , a kind of pin bonding structure is characterized in that comprising panel pin and drive IC pin;

  • The size and the shape of first welding disk of described panel pin and second welding disk of described drive IC pin are complementary;

    First welding disk of corresponding panel pin and second welding disk of drive IC pin are bonded together, and to form pad right;

    Described pad is to minute two rows, on arrange pad right lower limb be higher than the right coboundary of row'"'"'s pad down.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×