Curable epoxy resin composition, cured body thereof, and use thereof

Curable epoxy resin composition, cured body thereof, and use thereof

  • CN 101,535,367 A
  • Filed: 12/03/2007
  • Published: 09/16/2009
  • Est. Priority Date: 12/04/2006
  • Status: Active Application
First Claim
Patent Images

1. curable composition epoxy resin, it comprises following at least component:

  • (I) Resins, epoxy;

    (II) be used for curing agent for epoxy resin;

    (III) diorganosiloxane of representing with following general formula, wherein in per 100 parts by weight of component (I) and (II) sum, its consumption is the 0.1-100 weight part;

    A-R 2-(R 12SiO) nR 12Si-R 2-A R wherein 1Expression does not contain the identical or different univalence hydrocarbyl that does not replace or replace of unsaturated aliphatic key;

    R 2The expression divalent organic group, A represents the siloxanes residue represented with following averaged unit formula;

    (XR 12SiO 1/2) a(SiO 4/2) bR wherein 1Be singly-bound, hydrogen atom with the identical and X of above definition, use R 1The group of expression, contain the unit price organic group or the alkoxysilylalkyl of epoxy group(ing);

    Yet at least one group of representing with X is a singly-bound in a molecule, and at least two groups of representing with X are the alkyl that contain epoxy group(ing);

    A is a positive number;

    B is a positive number;

    With a/b be scope be the numerical value of 0.2-4 and wherein n be equal to or greater than 1 integer;

    With (IV) mineral filler, it is included in the composition with the consumption of 20wt% at least.

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