Thin-film semiconductor component and component assembly

Thin-film semiconductor component and component assembly

  • CN 101,542,752 A
  • Filed: 07/16/2007
  • Published: 09/23/2009
  • Est. Priority Date: 08/04/2006
  • Status: Active Application
First Claim
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1. thin-film semiconductor component (1) that has bearing bed (2) and be arranged on the stack layer (8) on the described bearing bed (2), described stack layer comprises semi-conducting material and in order to send radiation, wherein, on described bearing bed (2), apply heat dissipating layer (3) in order to cool off described thin-film semiconductor component (1).

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