Thin-film semiconductor component and component assembly

Thin-film semiconductor component and component assembly

  • CN 101,542,752 B
  • Filed: 07/16/2007
  • Issued: 01/22/2014
  • Est. Priority Date: 08/04/2006
  • Status: Active Grant
First Claim
Patent Images

1. a thin-film semiconductor component (1), has:

  • -bearing bed (2), described bearing bed (2) is paper tinsel,-being arranged on the layer stacking (8) on described bearing bed (2), described layer is stacking comprises semi-conducting material and in order to send radiation, and-the heat dissipating layer (3) in order to cooling described thin-film semiconductor component (1) that applies on described bearing bed (2),Three faces that-wherein said heat dissipating layer (3) is arranged between described layer stacking (8) and described bearing bed (2) and described layer stacking (8) extend beyond described layer stacking (8),-wherein said heat dissipating layer (3) forms closure plane, and the side that wherein limits described closure plane becomes curve trend, and wherein said heat dissipating layer (3) has the side of the evagination that the side of indent is relative with side with described indent, and-described layer stacking (8) is arranged on by the side of described indent.

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