LED module

LED module

  • CN 101,546,754 A
  • Filed: 03/26/2008
  • Published: 09/30/2009
  • Est. Priority Date: 03/26/2008
  • Status: Active Application
First Claim
Patent Images

1. light emitting diode module, it comprises a heat-conducting plate and some light-emitting diodes that is mounted on the heat-conducting plate, each light-emitting diode comprises that a light-emitting diode chip for backlight unit, a pedestal and are bonded on the pedestal and the sealing of encapsulate chip, it is characterized in that:

  • described chip directly be bonded on the heat-conducting plate by heat-conducting glue and by pedestal institute around.

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