There is the miniature microphone assembly of solder sealing ring

There is the miniature microphone assembly of solder sealing ring

  • CN 101,552,941 B
  • Filed: 02/20/2009
  • Issued: 04/06/2016
  • Est. Priority Date: 02/22/2008
  • Status: Active Grant
First Claim
Patent Images

1. a miniature microphone assembly, comprising:

  • Capacitive microphone transducer, it comprises microphone and connects electric contact or terminal;

    Microphone carrier, it comprises the carrier electrical terminals be formed on its first surface, wherein said microphone carrier also comprises the second surface of the plane be oppositely arranged with first surface, this second surface comprises and multiplely connects electric contact, is attached to the external circuit board to allow described miniature microphone assembly surface to install;

    Integrated circuit lead, it has first surface, this first surface comprises the tube core electrical terminals of signal amplification or the circuit for signal conditioning that can be operatively coupled to this integrated circuit lead, wherein said microphone connects electric contact and the first carrier and connects electric contact and to aim at and described tube core electrical terminals connects electric contact with Second support aims at, the input impedance of described tube core electrical terminals is higher than 100G Ω

    , each tube core electrical terminals and described microphone connect the distance that electric contact separates and are less than 250 μ

    m, andWherein, the first conductive path is arranged on the first surface of this integrated circuit lead, and described first conductive path forms the basic closed loop around this tube core electrical terminals, and the closed loop of this conduction is connected to ground,Second conductive path is arranged on the first surface of this microphone carrier, and described second conductive path forms the basic closed loop around this carrier electrical terminals,This first and second conductive path is mutually mechanically attached and electrical interconnection by attached dose,This microphone carrier comprises the baseplate material selected from printed circuit board (PCB) and pottery,This capacitive microphone transducer and integrated circuit lead are attached to and are electrically connected to this microphone carrier, and by being formed in the electric trace electrical interconnection in the lower floor of microphone carrier, andBy the reflow treatment of described miniature microphone assembly, dry air/nitrogen is encapsulated in the cavity set up between integrated circuit lead and microphone carrier.

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