Method for mounting semiconductor element and method for manufacturing semiconductor device

Method for mounting semiconductor element and method for manufacturing semiconductor device

  • CN 101,562,142 B
  • Filed: 02/09/2007
  • Issued: 04/23/2014
  • Est. Priority Date: 08/18/2006
  • Status: Active Grant
First Claim
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1. an installation method for semiconductor element, via outside connect convex electrode by this semiconductor element mounting on wiring plate, this installation method comprises the following steps:

  • Application reflux heat is processed the outside connection convex electrode of this semiconductor element is connected with this wiring plate, then applies step cooling and processes;

    Wherein, in this step cooling is processed;

    Cooling this semiconductor element being connected and this wiring plate, to reduce temperature,In temperature, reach after assigned temperature, keep this assigned temperature to reach the fixed time, andAfter this fixed time, cooling this semiconductor element and this wiring plate again, further to reduce temperature;

    AndWherein this assigned temperature is more than or equal to 80 ℃ and

    be less than 150 ℃

    , and this fixed time is more than or equal to 120 seconds.

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