Grinding equipment

Grinding equipment

  • CN 101,570,002 A
  • Filed: 05/04/2008
  • Published: 11/04/2009
  • Est. Priority Date: 05/04/2008
  • Status: Active Application
First Claim
Patent Images

1. a milling apparatus in order to grind at least one wafer, is characterized in that, this milling apparatus comprises:

  • One main body;

    One abrasive disk, this abrasive disk rotatably are provided with on this main body;

    One auxiliary fixture, this auxiliary fixture are arranged at this abrasive disk top, and have at least one location division;

    AndAt least one axle center has an end face, and described wafer then is fixed on this end face;

    Wherein, when this axle center was positioned in the described location division, the position in this axle center was fixed in this location division, made the end face in described axle center relative with this abrasive disk.

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