Method for forming conducting wire on radiating substrate by vacuum sputtering

Method for forming conducting wire on radiating substrate by vacuum sputtering

  • CN 101,573,000 A
  • Filed: 04/29/2008
  • Published: 11/04/2009
  • Est. Priority Date: 04/29/2008
  • Status: Active Application
First Claim
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1. vacuum splashing and plating forms the method for conducting wire on the insulating heat-conductive heat-radiating substrate, it is characterized in that may further comprise the steps:

  • (1) provides a heat-radiating substrate;

    (2) heat-radiating substrate is carried out pre-treatment, so that the cleaning surfaces of heat-radiating substrate;

    (3) will be disposed in the vacuum cavity through the heat-radiating substrate of pre-treatment;

    (4) inert gas is fed in this cavity, start sputtering aluminum target, carry out bombardment by ions and implant aluminium;

    (5) adjust the current density and the substrate bias of aluminium target synchronously;

    (6) progressively feed nitrogen, generate aluminium nitride film;

    (7) in generation metal conducting layer and metal protection layer on the outer sputter of heat-radiating substrate of aluminium nitride film arranged;

    (8) conductor part of etch-resisting film shade circuit diagram, the non-conductor part is removed in etching, sloughs etch-resisting film again.

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