Light emitting component module

Light emitting component module

  • CN 101,581,404 B
  • Filed: 05/13/2008
  • Issued: 05/20/2015
  • Est. Priority Date: 05/13/2008
  • Status: Active Grant
First Claim
Patent Images

1. a light-emitting device module, comprising:

  • Heating panel;

    LED source, is positioned at above this heating panel, and comprises substrate and be positioned at this surface and extend to the contact pad designed of the side of this substrate;

    Printed circuit board (PCB), is positioned at above this heating panel, has through hole, and wherein this LED source is arranged in this through hole;

    Circuit pattern, comprises connecting portion, is positioned at the sidewall of this through hole, and extension, is positioned on this printed circuit board (PCB);

    AndSolder, connects this contact pad designed this connecting portion with being positioned at this through-hole side wall being positioned at this substrate side surfaces, this LED source and this printed circuit board (PCB) is formed and is electrically connected.

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