A kind of method of new UV glue sticking chip packaged chip module

A kind of method of new UV glue sticking chip packaged chip module

  • CN 101,604,640 A
  • Filed: 07/07/2009
  • Published: 12/16/2009
  • Est. Priority Date: 07/07/2009
  • Status: Active Application
First Claim
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1. the method for a new UV glue sticking chip packaged chip module, described chip module comprises chip, solder joint and the spun gold of being located on the substrate, this method may further comprise the steps:

  • A, build a dam;

    around packed chip module, surround a dam with the low viscosity UV glue, all solder joints and spun gold are all enclosed into wherein;

    B, precuring;

    the chip module of being built a dam in the steps A is put into irradiation under the ultraviolet light source at once;

    C, filler;

    the chip in the box dam, solder joint and spun gold all are encapsulated in the module with the low viscosity UV glue in the steps A;

    D, ultraviolet curing;

    the chip module that filler is good among the step C is solidified under ultraviolet irradiation.

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