Chemically mechanical polishing head, equipment and method and planarized semiconductor wafer

Chemically mechanical polishing head, equipment and method and planarized semiconductor wafer

  • CN 101,607,381 A
  • Filed: 08/30/2001
  • Published: 12/23/2009
  • Est. Priority Date: 08/31/2000
  • Status: Active Application
First Claim
Patent Images

1. compliant member, its by not with substrate reaction and not with glossing in the polymeric material of the chemical reaction used make, and has an admittance surface at the back side that is used to keep substrate, it is characterized in that:

  • this compliant member has the hole, described hole is communicated with vacuum source, and to have substrate on the described admittance surface and have sufficient size in order to detect.

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