Metal polishing slurry and Ginding process

Metal polishing slurry and Ginding process

  • CN 101,611,476 B
  • Filed: 02/22/2008
  • Issued: 11/25/2015
  • Est. Priority Date: 02/27/2007
  • Status: Active Grant
First Claim
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1. a Ginding process, it is characterized in that, while metal chemical-mechanical grinding liquid is supplied on the abrasive cloth of grinding plate, while under the state that the substrate with the polished film comprising metal barrier and interlayer dielectric is pressed on the grinding cloth, relatively move grinding plate and substrate, to carry out cmp to the metal barrier of described polished film and interlayer dielectricDescribed interlayer dielectric is silicon system tunicle or organic polymer films,Described metal chemical-mechanical grinding liquid contains abrasive grains, oxidized metal dissolving agent, organic solvent and water,Described abrasive grains is made up of cataloid,Described abrasive grains comprises the second abrasive grains that the first abrasive grains that average 2 particle diameters are 5 ~ 39nm and average 2 particle diameters are 40 ~ 150nm,The pH of described metal chemical-mechanical grinding liquid is 2 ~ 5.

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